The large image: Infineon has developed the world’s thinnest silicon energy wafers, measuring simply 20 micrometers in thickness – about the identical as a human hair. These wafers promise vital efficiency positive factors for energy conversion functions throughout AI information facilities, shopper electronics, motor management programs, and computing {hardware}.
The thinness of silicon wafers is vital as a result of it reduces resistance and energy loss. Present-gen wafers measure 40 to 60 micrometers thick. By roughly halving the wafer’s thickness, Infineon has managed to slash substrate resistance by 50 %. This, in flip, results in over 15 % much less energy loss in comparison with different options.
These advantages are notably helpful for powering the high-performance AI processors in information middle servers. Such chips require voltages to be stepped down from 230V AC to below 1.8V DC, a feat achieved by Infineon’s breakthrough applied sciences, together with vertical energy supply.
Lowering silicon thickness to twenty micrometers posed vital technical challenges for Infineon’s engineers. The standard steel stack holding the chip on the wafer is definitely thicker than the goal 20-micrometer thickness, so that they needed to get artistic with an progressive wafer-grinding strategy to make it work.
Dealing with these delicate, paper-thin wafers additionally presents manufacturing challenges, similar to wafer bowing and separation points throughout the back-end meeting processes. Nevertheless, Infineon has efficiently overcome these obstacles whereas guaranteeing that the wafers stay sturdy and sturdy sufficient for high-volume manufacturing on present manufacturing strains.
The ultra-thin wafer know-how has already been certified and deployed in Infineon’s built-in Good Energy Levels for DC-DC conversion, with the primary clients already receiving deliveries. The corporate expects this energy-efficient design to fully change present low-voltage energy converter wafers throughout the subsequent three to 4 years.
With a robust patent portfolio defending the wafer innovation, Infineon is establishing a commanding lead in superior semiconductor manufacturing. Coupled with its silicon, silicon carbide, and gallium nitride portfolios, the ultra-thin wafers place Infineon on the forefront of key decarbonization and digitalization applied sciences.
“The brand new ultra-thin wafer know-how drives our ambition to energy totally different AI server configurations from grid to core in probably the most energy-efficient method,” stated Adam White, president of energy & sensor programs at Infineon. “As power demand for AI information facilities is rising considerably, power effectivity positive factors an increasing number of significance. For Infineon, this can be a fast-growing enterprise alternative. With mid-double-digit progress charges, we anticipate our AI enterprise to succeed in one billion euros throughout the subsequent two years.”
If you wish to try the world’s slimmest silicon wafers in particular person, Infineon will probably be exhibiting them off on the Electronica commerce present in Munich working November 12-15.
